Final substrate cleaning machine
Seal off product contamination from oil! We use a variety of transfer rolls tailored to specific characteristics, even within the same section.
This product is a final substrate cleaning machine for MSAP, copper plating, bumps, etc. It maximizes cleaning and processing capabilities using a variety of transport rolls tailored to specific features, even within the same section. Additionally, with the application of magnetic drive, it features a non-contact method for semi-permanent use and a structure that prevents foreign object generation. 【Features】 ■ Lower exhaust application ■ Water cleaning available inside the chamber ■ Individual pressure adjustment for knives ■ Thin plate compatibility and pressure tilt prevention ■ Top-down method application ■ Enhanced drying capability *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：ラットコーポレーション 本社：営業部・業務部
- 価格：Other
